JPS61171147U - - Google Patents
Info
- Publication number
- JPS61171147U JPS61171147U JP5499085U JP5499085U JPS61171147U JP S61171147 U JPS61171147 U JP S61171147U JP 5499085 U JP5499085 U JP 5499085U JP 5499085 U JP5499085 U JP 5499085U JP S61171147 U JPS61171147 U JP S61171147U
- Authority
- JP
- Japan
- Prior art keywords
- relay
- relays
- mounting block
- prevention frame
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002265 prevention Effects 0.000 claims description 6
Landscapes
- Patch Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5499085U JPH0136270Y2 (en]) | 1985-04-13 | 1985-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5499085U JPH0136270Y2 (en]) | 1985-04-13 | 1985-04-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61171147U true JPS61171147U (en]) | 1986-10-23 |
| JPH0136270Y2 JPH0136270Y2 (en]) | 1989-11-06 |
Family
ID=30577245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5499085U Expired JPH0136270Y2 (en]) | 1985-04-13 | 1985-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0136270Y2 (en]) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6910947B2 (en) | 2001-06-19 | 2005-06-28 | Applied Materials, Inc. | Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
| US6913938B2 (en) | 2001-06-19 | 2005-07-05 | Applied Materials, Inc. | Feedback control of plasma-enhanced chemical vapor deposition processes |
| US6984198B2 (en) | 2001-08-14 | 2006-01-10 | Applied Materials, Inc. | Experiment management system, method and medium |
| US7047099B2 (en) | 2001-06-19 | 2006-05-16 | Applied Materials Inc. | Integrating tool, module, and fab level control |
| US7069101B1 (en) | 1999-07-29 | 2006-06-27 | Applied Materials, Inc. | Computer integrated manufacturing techniques |
| US7082345B2 (en) | 2001-06-19 | 2006-07-25 | Applied Materials, Inc. | Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities |
| US7101799B2 (en) | 2001-06-19 | 2006-09-05 | Applied Materials, Inc. | Feedforward and feedback control for conditioning of chemical mechanical polishing pad |
| US7201936B2 (en) | 2001-06-19 | 2007-04-10 | Applied Materials, Inc. | Method of feedback control of sub-atmospheric chemical vapor deposition processes |
| US7221990B2 (en) | 2004-05-28 | 2007-05-22 | Applied Materials, Inc. | Process control by distinguishing a white noise component of a process variance |
| US7225047B2 (en) | 2002-03-19 | 2007-05-29 | Applied Materials, Inc. | Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements |
| US7337019B2 (en) | 2001-07-16 | 2008-02-26 | Applied Materials, Inc. | Integration of fault detection with run-to-run control |
| US7349753B2 (en) | 2004-05-28 | 2008-03-25 | Applied Materials, Inc. | Adjusting manufacturing process control parameter using updated process threshold derived from uncontrollable error |
| US8694145B2 (en) | 2001-06-19 | 2014-04-08 | Applied Materials, Inc. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
-
1985
- 1985-04-13 JP JP5499085U patent/JPH0136270Y2/ja not_active Expired
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7069101B1 (en) | 1999-07-29 | 2006-06-27 | Applied Materials, Inc. | Computer integrated manufacturing techniques |
| US7174230B2 (en) | 1999-07-29 | 2007-02-06 | Applied Materials, Inc. | Computer integrated manufacturing techniques |
| US7101799B2 (en) | 2001-06-19 | 2006-09-05 | Applied Materials, Inc. | Feedforward and feedback control for conditioning of chemical mechanical polishing pad |
| US7047099B2 (en) | 2001-06-19 | 2006-05-16 | Applied Materials Inc. | Integrating tool, module, and fab level control |
| US7082345B2 (en) | 2001-06-19 | 2006-07-25 | Applied Materials, Inc. | Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities |
| US6910947B2 (en) | 2001-06-19 | 2005-06-28 | Applied Materials, Inc. | Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
| US6913938B2 (en) | 2001-06-19 | 2005-07-05 | Applied Materials, Inc. | Feedback control of plasma-enhanced chemical vapor deposition processes |
| US7201936B2 (en) | 2001-06-19 | 2007-04-10 | Applied Materials, Inc. | Method of feedback control of sub-atmospheric chemical vapor deposition processes |
| US8694145B2 (en) | 2001-06-19 | 2014-04-08 | Applied Materials, Inc. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| US7337019B2 (en) | 2001-07-16 | 2008-02-26 | Applied Materials, Inc. | Integration of fault detection with run-to-run control |
| US6984198B2 (en) | 2001-08-14 | 2006-01-10 | Applied Materials, Inc. | Experiment management system, method and medium |
| US7225047B2 (en) | 2002-03-19 | 2007-05-29 | Applied Materials, Inc. | Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements |
| US7221990B2 (en) | 2004-05-28 | 2007-05-22 | Applied Materials, Inc. | Process control by distinguishing a white noise component of a process variance |
| US7349753B2 (en) | 2004-05-28 | 2008-03-25 | Applied Materials, Inc. | Adjusting manufacturing process control parameter using updated process threshold derived from uncontrollable error |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0136270Y2 (en]) | 1989-11-06 |